Technology

CyOptics core capabilities are in design and production of high performance photonic chips such as laser diodes (LD’s) detectors and avalanche photodiodes (APD’s) and in integration and miniaturization of optical engine packaged modules for telecommunications systems.

CyOptics breakthrough photonic integration technology answers today’s market demands by mimimizing size, cost and power consumption of components for optical networking systems.

Semiconductor chip integration technology (called monolithic integration) enables producing several devices such as lasers, modulators and connecting optical waveguides on the same semiconductor chip. CyOptics many years of expertise in this field makes it a leader in integrated laser and modulator (EML) line of products as well as in laser and detector arrays for CWDM and DWDM applications.

CyOptics expertise in high precision robotic packaging technology enables the production of highly miniaturized packages containing many optical and electrical parts, such as lasers and EML’s with electrical driver chips located inside a single package. This technology is well suited for high volume- low cost manufacturing- resulting in performance and cost benefits for our customers.