Full Product & Service Line
Below you will find a complete list of all our products and services. If you need to narrow down your results you may search by keywork using the form provided above or use our website navigation options. |
Chips
| Data Rate |
Description |
Data Sheet |
| CW |
1.5 µm High power DFB chip, CW, DWDM |
295M |
| 2.5 Gb/s |
APD chip/ chip on carrier |
124NLV |
| 2.5 Gb/s |
1.3 µm DFB chip for Uncooled CWDM applications |
293B - CWDM |
| 2.5 Gb/s |
1.3 µm DFB chip for Uncooled applications up to 40 km, & CATV |
293BU |
| 2.5 Gb/s |
1.3 µm DFB with Integrated Spot Size Converter |
293C |
| 2.5 Gb/s |
1.5 µm EML chip for Cooled applications up to 640 km, DWDM |
294W |
| 2.5 Gb/s |
1.5 µm DFB chip for Cooled applications up to 100 km, DWDM |
295G |
| 2.5 Gb/s |
1.5 µm DFB chip for Uncooled applications up to 80 km, CWDM |
295J |
| 2.5 Gb/s |
1.5 µm DFB chip for Cooled applications up to 200 km, DWDM |
295L |
| 2.5 Gb/s |
1.3 µm FP chip for Uncooled applications up to 10 km |
299F |
| 2.5 Gb/s |
1.3 µm DFB chip in flat-window TO-can for 40 km Uncooled applications |
TO293BU-A |
| 2.5 Gb/s |
1.3 µm DFB chip in TO-can with 2mm ball lens for 40 km Uncooled applications |
TO293BU-B |
| 2.5 Gb/s |
1.3 µm DFB chip in TO-can with 7.5mm focal point lens for 40 km applications |
TO293BU-C |
| 2.5 Gb/s |
1.3 µm DFB chip in TO-can with 8.6mm focal point lens for 40 km applications |
TO293BU-D |
| 2.5 Gb/s |
1.3 µm DFB chip in TO-can with 10.1mm focal point lens for 40 km applications |
TO293BU-E |
| 2.5 Gb/s |
1.5 µm DFB chip in flat-window TO-Can for 80 km applications |
TO295J-A |
| 2.5 Gb/s |
1.5 µm DFB chip in TO-can with 2mm ball lens for 80 km Uncooled applications |
TO295J-B |
| 2.5 Gb/s |
1.5 µm DFB chip in TO-can with 7.5mm focal point lens for 80 km applications |
TO295J-C |
| 2.5 Gb/s |
1.5 µm DFB chip in TO-can with 8.6mm focal point lens for 80 km applications |
TO295J-D |
| 2.5 Gb/s |
1.5 µm DFB chip in TO-can with 10.1mm focal point lens for 80 km applications |
TO295J-E |
| 2.5 Gb/s |
1.49 µm DFB chip in flat-window TO-can for FTTx applications to 20km |
TO295J149-A |
| 2.5 Gb/s |
1.49 µm DFB chip in TO-can with 2mm ball lens for FTTx applications |
TO295J149-B |
| 2.5 Gb/s |
1.49 µm DFB chip in TO-can with 7.5mm focal point lens for FTTx applications |
TO295J149-C |
| 2.5 Gb/s |
1.49 µm DFB chip in TO-can with 8.6mm focal point lens for FTTx applications |
TO295J149-D |
| 2.5 Gb/s |
1.49 µm DFB chip in TO-can with 10.1mm focal point lens for FTTx applications |
TO295J149-E |
| 2.5 Gb/s |
Lensed APD with Cosided Contacts |
124NTCO |
| 2.5 Gb/s |
CWDM DFB chip in flat-window TO-Can for up to 80km applications |
TO295Jxxx-A |
| 2.5 Gb/s |
CWDM DFB chip in TO-can with 7.5mm focal point lens, 80km applications |
TO295Jxxx-C |
| 2.5 Gb/s |
CWDM DFB chip in TO-can with 10.1mm focal point lens, 80km applications |
TO295Jxxx-E |
| 10 Gb/s |
Lensed PIN Chip |
108FET |
| 10 Gb/s |
APD chip/ chip on carrier |
124EAT/Q |
| 10 Gb/s |
1.3 µm DFB chip for Uncooled applications up to 20 km |
293BT |
| 10 Gb/s |
1.3 µm FP Chip for Wide-Temperature Uncooled applications up to 1km |
299K |
| 10 Gb/s |
1.3 µm DFB Chip for Wide-Temperature Uncooled applications up to 20km |
293K |
| 10 Gb/s |
1.5 µm EML Chip for Cooled applications up to 10Gb/s |
294U |
| 10 Gb/s |
1.3 µm FP Chip in TO-can for Wide-Temperature Uncooled applications |
TO299K |
| 10 Gb/s |
1.3 µm DFB Chip in TO-can for Wide-Temperature Uncooled applications |
TO293K |
Components
| Data Rate |
Description |
Data Sheet |
| CW |
20mW CW Full C-Band Tunable Laser Butterfly Module with Wavelength Stabilizer |
S3500 |
| CW |
20mW CW Full C-Band Integrable Tunable Laser Assembly (ITLA) Module with Wavelength Stabilizer |
S3600 |
| CW |
20mW CW Wavelength-Selected Isolated DFB Laser Butterfly Module with PMF, DWDM |
D2547P |
| 155-622 Mb/s |
1.3 µm Digital Uncooled Fabry Perot miniDIL Laser Module |
D370 |
| 155-622 Mb/s |
1.3 µm Digital Uncooled DFB miniDIL Laser Module |
D371 |
| 155-622 Mb/s |
1.5 µm Digital 1.5 µm Uncooled DFB miniDIL Laser Module |
D571 |
| 2.5 Gb/s |
1.5 µm Cooled Isolated DFB Laser Butterfly Module for applications up to 3200 ps/nm (160km+) and 10mW output power |
D2570 26 55 |
| 2.5 Gb/s |
1.5 µm Cooled Isolated DFB Laser Butterfly Module for applications up to 3600 ps/nm (180km+) and 10mW output power |
D2575 |
| 2.5 Gb/s |
1.3 µm Digital Uncooled DFB miniDIL Laser Module |
D372 |
| 2.5 Gb/s |
1.5 µm Digital Uncooled DFB miniDIL Laser Module |
D572 |
| 2.5 Gb/s |
1.5 µm Cooled Isolated EML Butterfly Module for 12,000 ps/nm (600km+) DWDM applications |
E2502 |
| 2.5 Gb/s |
1.5 µm Cooled Isolated EML Butterfly Module for 7200 ps/nm (360km+) DWDM applications |
E2505 |
| 2.5 Gb/s |
PIN or APD Mini-DIL Receiver |
P172 |
| 2.5 Gb/s |
APD MiniDIL Receiver with Improved Sensitivity |
P173A |
| 2.5 Gb/s |
PIN MiniDIL Receiver with Improved Sensitivity |
P173P |
| 2.5 Gb/s |
APD MiniDIL Receiver with Improved Sensitivity in noise-loaded (amplified) applications |
P174A |
| 2.5 Gb/s |
PIN MiniDIL Receiver with Improved Sensitivity in noise-loaded (amplified) applications |
P174P |
| 10 Gb/s |
1.5 µm Cooled Isolated EML Butterfly Module for 800 ps/nm (40km+) DWDM applications |
E2560 |
| 10 Gb/s |
1.5 µm Cooled Isolated EML Butterfly Module for 500 ps/nm (20km+) applications |
E2566 |
| 10 Gb/s |
1.5 µm High-power Cooled Isolated EML Butterfly Module for 800 ps/nm (40km+) DWDM applications |
E4560 |
| 10 Gb/s |
1.5 µm Low and High-power Cooled Isolated EML Butterfly Modules for 1600 ps/nm (80km+) DWDM applications |
E4565/6 |
| 10 Gb/s |
1.5 µm Cooled EAM Butterfly LIM, to +4dBm, 90km |
LIM10x |
| 10 Gb/s |
MSA Compliant Co-Planar APD Receiver (+3.3V) with high sensitivity |
R197A |
| 10 Gb/s |
MSA Compliant Co-Planar APD Receiver (+3.3V) with linear TIA |
R197AL |
| 10 Gb/s |
MSA Compliant Co-Planar APD Receiver (+3.3V) with high sensitivity (alternate TIA) |
R198A |
| 40 Gb/s |
1.5 µm Cooled EAM Butterfly LIM for 40Gb/s transmission |
A40-0067-X01 |
TOSA/ROSA
| Data Rate |
Description |
Data Sheet |
| 2.5 Gb/s |
1.5 µm Cooled, Planar DFB MSA TOSA, 120km |
1610 |
| 2.5 Gb/s |
1.5 µm Cooled, Planar DFB MSA TOSA, 200km |
1611 |
| 4.25 Gb/s |
MSA Multi-Rate (up to 4.25Gb/s) Cooled, Planar DWDM DFB TOSA, 80km |
1608 |
| 10 Gb/s |
1.3 µm Uncooled, Cylindrical EML TOSA (10GbE, extended temperature) |
A15-0002 |
| 10 Gb/s |
1.3 µm Uncooled, Cylindrical EML TOSA (multi-rate, commercial temperature) |
A15-0003 |
| 10 Gb/s |
1.3 µm Uncooled, Cylindrical EML TOSA (multirate, special temperature) |
A15-0006 |
| 10 Gb/s |
1.3 µm Uncooled, Cylindrical EML TOSA (10GbE, special temperature) |
A15-0007 |
| 10 Gb/s |
1.3 µm Uncooled, Cylindrical XMD DFB TOSA (10G, extended temperature) |
TX293K |
| 10 Gb/s |
1.3 µm Uncooled, Cylindrical XMD Fabry-Perot TOSA (10G, extended temperature) |
TX299K |
| 10 Gb/s |
1.5 µm Cooled, Planar EML XMD MSA TOSA, 40km |
1625 |
| 10 Gb/s |
1.5 µm Cooled, Planar EML XMD MSA TOSA, 80km |
1626 |
| 10 Gb/s |
1.5 µm Cooled, Planar EML TOSA with Integral Driver IC, 40km |
1635 |
| 10 Gb/s |
1.5 µm Cooled, Planar EML TOSA with Integral Driver IC, 80km |
1636 |
| 10 Gb/s |
High-Sensitivity Planar PIN ROSA with TIA |
1640 |
| 10 Gb/s |
Planar PIN ROSA with Linear TIA |
1640L1 |
| 10 Gb/s |
High Sensitivity Planar APD ROSA with TIA |
1641 |
| 10 Gb/s |
Planar APD ROSA with Linear TIA |
1641L1 |
| 10 Gb/s |
High-Sensitivity Planar XMD APD ROSA with TIA |
1644 |
| 40 Gb/s |
CWDM (1270 to 1330nm) Uncooled DFB TOSAs, 10Gb/s per channel, for 40G Ethernet, IEEE 802.3ba 40GBASE-LR4 to 10km |
TXxxxx (CWDM) |
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